What beaker said.
Most fabs today are using better quality silicon, and better/different doping and microfabrication methods to make SMD chips vs the old through hole parts.
Also, in the mid-80s Motorola started the whole 6-sigma quality management trend, meaning that the goal is 3.4 defects per million opportunities. Like Beaker said, even tho the spec may be ±10%, for all intents and purposes you're going to see a significantly smaller variation for any given batch.